Wi2Wi宣布WC7220B0蓝牙低能耗(BLE)模块
来源:http://www.yijindz.com 作者:亿金电子 2024年03月05
Wi2Wi宣布WC7220B0蓝牙低能耗(BLE)模块
Wi2Wi宣布WC7220B0为同类最佳蓝牙低能耗(BLE)模块
Wi2Wi公司(“Wi2Wi”或“公司”),全球领先的端到端无线连接解决方案、高精度频率控制、定时和微波滤波器设备开发商和制造商,很高兴宣布WC7220B0石英晶振,一款超小型、超低功耗高性能蓝牙低能耗(BLE)模块,来自其MCU嵌入式(ME)系列产品。
Wi2Wi公司(“Wi2Wi”或“公司”),全球领先的端到端无线连接解决方案、高精度频率控制、定时和微波滤波器设备开发商和制造商,很高兴宣布WC7220B0石英晶振,一款超小型、超低功耗高性能蓝牙低能耗(BLE)模块,来自其MCU嵌入式(ME)系列产品。
“WC7220B0是Wi2W威尔威晶振公司丰富的连接产品组合中令人兴奋的新成员,旨在满足物联网(IoT)和工业物联网(IIoT/M2M)市场对超小型封装产品性能的集成需求。嵌入式微控制器WC7220B0为最终客户系统提供即插即用蓝牙LE集成。在终端系统中采用该模块将大大减少终端客户的上市时间和整体产品开发成本。该公司将继续专注于发布经济高效、同类最佳的即插即用无线连接解决方案,以支持物联网和物联网市场不断增长的需求。”董事会主席迈克尔·索南里奇说。
“WC7220B0满足了行业对超小型和超低功耗、经济高效的即插即用蓝牙LE模块的需求,满足了IoT和IIoT市场中各种传感器应用的需求。这是我们今年的第五款新产品,是该公司如何创造简单易用性来增强客户产品的一个例子。该公司继续专注于开发无线连接和频率控制产品线中的一流产品。”Wi2Wi总裁兼首席执行官Zachariah Mathews表示。
WC7220B0Wi2Wi的MCU嵌入式(ME)系列有源晶振是一款集成芯片天线的无主机单模蓝牙低能耗(BLE 4.1/蓝牙智能)模块,具有业界最高的集成度,可提供一流的特性、性能和功能。这款独立的蓝牙LE模块集成了微控制器、嵌入式BT LE 4.1堆栈和应用配置文件,支持终端系统连接到个人区域网络(PAN)中的任何智能手机、平板电脑或任何其他支持BLE的设备。WC7220B0BLE模块是一个完全集成的子系统,包括MCU、MAC、基带、RF前端、LNA、PA、晶体、滤波器、天线和EEPROM。这款超低功耗BLE模块具有多种掉电模式,功耗低至纳安,可提供出色的电池续航时间,并可使用CR2032等小型纽扣电池供电。额外内存在WC7220B0使系统开发人员能够在模块中编写用户应用程序,无需任何外部微控制器。该模块提供多种接口,如UART和I2C。具有模拟、数字和PWM功能的GPIOs也可用于与外部多个外设和传感器通信。WC7220B0非常适合智能健康、智能家居、智能能源、互联网设备中的各种传感器应用以及智能制造中的各种传感器应用。
Wi2Wi的MCU嵌入式系列产品WC7220B0是一款集成芯片天线的无主机单模蓝牙低功耗(BLE)模块。这款独立的BLE模块具有板载微控制器、嵌入式BLE 4.1堆栈和应用配置文件,使系统能够连接到个人区域网络(PAN)中的任何智能手机/平板电脑或任何其他支持BLE的设备。WC7220B0石英晶体振荡器是业界最小的BLE模块之一,它是一个子系统,包括MCU、MAC、基带、RF前端、LNA、PA、晶体、滤波器和EEPROM。这款超低功耗BLE模块具有多种掉电模式,功耗低至纳安,可提供出色的电池续航时间,并可使用CR2032等小型纽扣电池供电。WC7220B0 -无主机BLE模块中的额外内存将使系统开发人员能够编写用户应用程序,并且无需任何外部微控制器。此外,具有模拟、数字和PWM功能的UART、I2C、GPIOs等接口也可用于与外部外设和传感器通信。WC7220B0 -独立ble模块通过FCC、CE和IC认证,并具有扩展温度等级;-30摄氏度至+85摄氏度。
Wi2Wi的MCU嵌入式系列产品WC7220B0是一款集成芯片天线的无主机单模蓝牙低功耗(BLE)模块。这款独立的BLE模块具有板载微控制器、嵌入式BLE 4.1堆栈和应用配置文件,使系统能够连接到个人区域网络(PAN)中的任何智能手机/平板电脑或任何其他支持BLE的设备。WC7220B0石英晶体振荡器是业界最小的BLE模块之一,它是一个子系统,包括MCU、MAC、基带、RF前端、LNA、PA、晶体、滤波器和EEPROM。这款超低功耗BLE模块具有多种掉电模式,功耗低至纳安,可提供出色的电池续航时间,并可使用CR2032等小型纽扣电池供电。WC7220B0 -无主机BLE模块中的额外内存将使系统开发人员能够编写用户应用程序,并且无需任何外部微控制器。此外,具有模拟、数字和PWM功能的UART、I2C、GPIOs等接口也可用于与外部外设和传感器通信。WC7220B0 -独立ble模块通过FCC、CE和IC认证,并具有扩展温度等级;-30摄氏度至+85摄氏度。
该模块已通过FCC、CE和IC认证,并附带开箱即用的集成工具,其中包含所有必需的协议栈、丰富的软件库(包括云访问支持和示例应用程序)。可根据要求提供样品和开发套件。
Wi2Wi宣布WC7220B0蓝牙低能耗(BLE)模块
Wi2Wi宣布WC7220B0蓝牙低能耗(BLE)模块
Wi2Wi announces WC7220B0 the Best in Class Bluetooth Low Energy (BLE) Module
Wi2Wi Corporation ("Wi2Wi" or the "Company"), a leading global developer and manufacturer of end to end Wireless Connectivity Solutions, high precision Frequency Control, Timing, and Microwave Filter devices, is pleased to announce WC7220B0, an Ultra-Small, Ultra-Low Power High Performance Bluetooth Low Energy (BLE) module, from its MCU Embedded (ME) family of products.
“WC7220B0 is an exciting addition to Wi2Wi's rich connectivity product portfolio addressing the integration demand for best in class performance in an ultra-small package footprint in the Internet of Things (IoT) and Industrial Internet of Things (IIoT/M2M) markets. The microcontroller embedded WC7220B0 provides plug and play Bluetooth LE integration to the end customer systems. Adopting this module in their end systems will substantially reduce the end customer’s time to market overall product development cost. The Company will continue to focus on releasing cost effective, best in class plug and play wireless connectivity solutions to support the ever growing demand of the IoT and IIoT markets.” said Michael Sonnenreich, Chairman of the Board.
“WC7220B0 answers industry’s demand for ultra-small and ultra-low power cost effective plug and play Bluetooth LE module demand for various sensor applications in the IoT and IIoT markets. This is our fifth new product this year and is an example of how the Company is creating simplicity and ease of use to enhance our customers’ products. The Company continue its focus in developing best in class products from both wireless connectivity and Frequency Control product lines. ” said Zachariah Mathews, President and CEO of Wi2Wi.
WC7220B0 from Wi2Wi's MCU Embedded (ME) Series is a Host-Less Single-Mode Bluetooth Low Energy (BLE 4.1/Bluetooth Smart) module with integrated chip antenna and has industry’s highest level integration that provides best in class features, performance and functionality. This self-contained Bluetooth LE module with integrated microcontroller, embedded BT LE 4.1 stack and application profiles enables the end system connect to any smartphone, tablet or any other BLE enabled devices in a Personal Area Network (PAN). WC7220B0 BLE module is a fully integrated subsystem that includes MCU, MAC, baseband, RF front-end, LNA, PA, crystals, filter, antenna and EEPROM. This ultra-low power BLE module with multiple Power-down modes consumes as low as nano amps which provides excellent battery life and can be powered with a small coin cell battery like CR2032. Extra memory in WC7220B0 enable the system developers to write user application programs in the module and eliminate the need for any external Microcontroller. This module provides multiple interfaces such as UART and I2C. GPIOs with Analog, Digital and PWM functionality are also available to communicate with external multiple peripherals and sensors. WC7220B0 is ideal for various sensor applications in the Smart Health, Smart Home, Smart Energy, Internet enabled devices and various sensor applications in Smart Manufacturing.
The module is being certified for FCC, CE, and IC and comes with out of the box integration tools with all the required protocol stacks, extensive software libraries including cloud access support and sample applications. Samples and Development kits are available upon request.
Type/Series | Image | Package | Output | Frequency Range | Dimensions | Features |
---|---|---|---|---|---|---|
LV5 |
SMD Seam Welded |
LVDS | 40MHz to 200MHz | 5.00mm x 3.20mm x 1.20mm |
Low Phase Noise |
|
LV7 |
SMD Seam Welded |
LVDS | 40MHz to 200MHz | 7.0mm x 5.0mm x 1.8mm |
3.3V and 2.5V Available |
|
O08 | DIP8 |
TTL/CMOS LVCMOS |
30KHz to 200MHz | 13.2mm x 13.2mm x 5.6mm |
4-Pin E/D Optional |
|
O14 | DIP14 |
TTL/CMOS LVCMOS |
30KHz to 200MHz | 20.4mm x 12.8mm x 5.08mm |
4 to 14 - Pin E/D Optional |
|
OC2 |
SMD Seam Welded |
TTL/CMOS LVCMOS |
30KHz to 50MHz | 2.5mm x 2.0mm x 1.0mm |
Small Footprint |
|
OC3 |
SMD Seam Welded |
TTL/CMOS LVCMOS |
30KHz to 80MHz | 3.2mm x 2.5mm x 1.0mm |
Small Footprint |
|
OC5 |
SMD Seam Welded |
TTL/CMOS LVCMOS |
30KHz to 200MHz | 5.0mm x 3.2mm x 1.3mm |
Wide Frequency Range |
|
OC7 |
SMD Seam Welded |
TTL/CMOS LVCMOS |
30KHz to 200MHz | 7.0 x 5.0 x 1.8mm |
5V Available |
|
PE5 |
SMD Seam Welded |
LVPECL | 40MHz to 200MHz | 5.0mm x 3.2mm x 1.2mm |
Low Jitter |
|
PE7 |
SMD Seam Welded |
LVPECL | 40MHz to 200MHz | 7.0 x 5.0 x 1.8mm |
E/D Optional |
|
DH-1 | Ceramic SMD | CMOS | 32.768 KHz | 7.86mm x 3.60mm x 2.00mm |
Rugged Design Wide Operating Temp Range |
|
DL-4 | Ceramic J-Lead | LVCMOS | 0.5MHz - 80MHz | 8.89mm x 7.37mm x 4.32mm |
Rugged Design Wide Operating Temp Range |
|
FC7 | SMD Seam Weld |
LVCMOS LVDS LVPECL |
10MHz to 1GHz | 7.0mm x5.0mm x1.8mm |
Rugged Design Wide Operating Temp Range |
|
JC7 |
J Lead Gull Wing Thru Hole |
TTL/CMOS LVCMOS HCMOS |
30KHz - 200MHz | 7.0mm x 5.0mm x 1.6mm | ||
JL9 |
Ceramic J-Lead |
TTL/CMOS LVCMOS HCMOS |
30KHz - 200MHz | 14mm x 9mm x 4.7 mm | E/D Optional | |
JL4 |
Ceramic J-Lead |
TTL/CMOS LVCMOS |
30KHz - 200MHz | 8.9mm x 7.4mm x 4.3 mm |
1.8V to 3.3V available |
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此文关键字: 蓝牙模块晶振
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